| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has high sensitivity and provides a cured film excellent in mechanical strength and flexibility by baking at a low temperature of ≤200°C. <P>SOLUTION: The positive photosensitive resin composition includes (a) an alkali-soluble polyimide resin, (b) a novolac resin, (c) a heat-crosslinkable compound, (d) a photoacid generator, and (e) a solvent, wherein the content of the heat-crosslinkable compound (c) is 15-80 pts.wt. based on 100 pts.wt., in total, of the resins (a) and (b). The heat-crosslinkable compound (c) includes at least (c1) a compound represented by general formula (1) or a condensate thereof and (c2) that is a compound represented by general formula (2) or a condensate thereof.The content ratio of the (c1) to (c2), (c1)/(c2) is 50/50 to 90/10 (weight ratio). <P>COPYRIGHT: (C)2010,JPO&INPIT |
