| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device that is miniaturized. Ž<P>SOLUTION: The semiconductor laser device A includes: a semiconductor laser chip 2 having at least one semiconductor laser element; a mounting unit 11 where the semiconductor laser chip 2 has been mounted; a lead 1 having a terminal 13 making continuity with the semiconductor laser chip 2; and a resin package 3 for covering one portion of the lead 1. In the semiconductor laser device A, the mounting unit 11 makes continuity with the semiconductor laser chip 2, a side where the terminal 13 projects from the resin package 3 is covered with the resin package 3, the lead 1 is connected to the mounting unit 11, and further an overhang terminal 12 exposed in a direction different from that of the terminal 13 from the resin package 3 is further provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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