发明名称 THERMOSETTING COMPOSITION
摘要 <p>PURPOSE: A thermosetting composition, a method for sealing an optical semiconductor device using the same, and the optical semiconductor device are provided to be suitably used for photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like). CONSTITUTION: A thermosetting composition comprises an aluminosiloxane, a silicone oil comprising silanol groups at both ends, an epoxy silicone, and a silicone elastomer. A thermosetting composition is obtainable by the steps of: reacting a silicone oil comprising silanol groups at both ends and aluminum isopropoxide to provide a mixture A comprising an aluminosiloxane and unreacted silicone oil comprising silanol groups at both ends; and mixing the mixture A with an epoxy silicone, and subsequently with a silicone elastomer. The aluminosiloxane is a compound represented by chemical formula (I), wherein an average of n1 to n3 is from 40 to 155.</p>
申请公布号 KR20100033927(A) 申请公布日期 2010.03.31
申请号 KR20090085392 申请日期 2009.09.10
申请人 NITTO DENKO CORPORATION 发明人 KATAYAMA HIROYUKI
分类号 C08L83/04;C08L91/00;H01L51/54 主分类号 C08L83/04
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