发明名称 Positive photosensitive resin composition
摘要 A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).
申请公布号 US7687208(B2) 申请公布日期 2010.03.30
申请号 US20070309766 申请日期 2007.08.10
申请人 ASAHI KASEI EMD CORPORATION 发明人 SHIBUI SATOSHI
分类号 G03F7/023;G03F7/30 主分类号 G03F7/023
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