| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an element having a through-hole with excellent accuracy and mass productivity. <P>SOLUTION: A resin block 6, for which a peripheral region R2 including a region R1 where the through-hole 2 is to be formed and a region R3 where a circuit pattern is to be formed (or the peripheral region excluding the region where the circuit pattern is to be formed) are made to be a projected part 4 (or a recessed part) on one front or back surface 6a (6b) and a hole 5 whose end part 5a is settled inside the projected part of the region R1 is provided in the region R1 where the through-hole 2 is to be formed on the other surface 6b (6a), is formed by a resin molding method. The projected part 4 is removed so that the hole 5 passes through. A conductive film 8 is formed on the exposed surface of the resin block 6. The conductive film 8 is removed so as to expose the end face of the projected part 4, and the conductive films 8 formed on the front surface 6a and back surface 6b of the resin block 6 are electrically connected through the through-hole 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
