METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate sheet capable of using a screen plate continuously for a long time and transferring conductive paste in a state that the screen plate is slightly separated from a base material.

SOLUTION: The method for manufacturing a multilayer printed wiring board includes: a base material step of holding a base material 60 including a planar member 62 having a plurality of planar convex portions 62a and a lower substrate sheet 61 having substrate convex portions 61a; a step of transferring conductive paste 70 between the substrate convex portions 61a; and a step of curing the conductive paste 70 to form conductive bumps 71. Furthermore, the method for manufacturing a multilayer printed wiring board includes: a step of placing an upper substrate sheet 61' on the conductive bumps 71 and pressing the sheet to allow the conductive bumps 71 to penetrate the lower surface of the sheet; and a step of masking predetermined regions of the substrate sheets 61, 61' and removing a region other than the predetermined regions to form a circuit. The substrate convex portions 61a of the lower substrate sheet 61 are formed in positions other than the predetermine regions and removed when the circuit is formed.

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