| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder jointing method controlling the height of molten solder between a mounting member and a mounted member to reduce a difference in final height between the members after solidification of the solder and a mounted member. <P>SOLUTION: In the solder jointing method of solidifying the molten solder (a solder bump 17a of a bumped bare IC 17) interposed between the bumped bare IC 17 as the mounting member and a substrate 18 as the mounted member to join the bumped bare IC 17 and the substrate 18, a load exerted onto the molten solder bump 17a between the bumped bare IC 17 and the substrate 18 is controlled to be a target load determined in advance from its desired height between the bumped bare IC 17 and the substrate 18 and the volume of the solder bump 17a. <P>COPYRIGHT: (C)2010,JPO&INPIT |
