| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method for precisely detecting a transition point of polishing such as film removal, and monitoring a locally polished state in the surface of a substrate. <P>SOLUTION: The polishing device includes: a polishing table 2 to which a polishing pad 1 with a polishing surface 1a is attached; and a substrate holding section 3 for pressing the substrate W on the polishing surface 1a, and polishes the surface of the substrate W by relatively moving the polishing table 2 and the substrate holding section 3. The polishing device includes: a target 10 which is in contact with the surface of the substrate W; a vibration measurement section 11 for measuring at least one of an amplitude and a frequency of the vibration of the target 10; and a control section 12 for controlling a polishing process based on at least one of the amplitude and the frequency measured by the vibration measurement section 11. <P>COPYRIGHT: (C)2010,JPO&INPIT |
