HIGH-SOLID hBN SLURRY, hBN PASTE, SPHERICAL hBN POWDER, AND METHODS OF MAKING AND USING THEM

摘要

PROBLEM TO BE SOLVED: To provide a thermally conductive filler material which can be used at high fill levels to achieve sufficient thermal conductivity without increasing viscosity.

SOLUTION: There is provided a spherical boron nitride powder including the spherical agglomerates of boron nitride platelets preferably having an average agglomerate size of from 10 to 500 microns.

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