| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the heat radiation property of a semiconductor device. <P>SOLUTION: This semiconductor includes: a die pad (chip mounting part) 1 having a top surface (first main surface) 1a; a plurality of leads 2 arranged around the die pad 1; a semiconductor chip 3 having a main surface (second main surface) 3a, a back surface (second back surface) 3b, and a plurality of pads formed to the main surface 3a, and having the back surface 3b fixedly adhered in opposing contact with the top surface 1a of the die pad 1; a plurality of wires 5 electrically connecting the plurality of pads 3d of the semiconductor chip 3 and the plurality of leads 2, respectively; and a sealing body 6 sealing the semiconductor chip 3 and the plurality of wires 5. In addition, a plurality of groove portions (first groove portions) 1d are formed to a chip-mounting region (first region) 1e opposing the back surface 3b of the semiconductor chip 3 in the top surface 1a of the die pad 1, and an adhesive 9 for fixedly adhering the semiconductor chip 3 to the top surface 1a of the die pad 1 is buried in the plurality of groove portions 1d. <P>COPYRIGHT: (C)2010,JPO&INPIT |
