发明名称 |
Method of manufacturing a semiconductor device |
摘要 |
The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.
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申请公布号 |
US7678706(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20070780585 |
申请日期 |
2007.07.20 |
申请人 |
RENESAS TECHNOLOGY CORP.;HITACHI ULSI SYSTEMS CO., LTD. |
发明人 |
MIYAKI YOSHINORI;SUZUKI HIROMICHI;SUZUKI KAZUNARI;NISHITA TAKAFUMI;ITO FUJIO;TSUBOSAKI KUNIHIRO;KAMEOKA AKIHIKO;NISHI KUNIHIKO |
分类号 |
H01L21/302;H01L23/31;H01L23/495 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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