| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-piece wiring substrate suitable for workability when dividing a mother substrate at the boundary in a wiring substrate region and excellent in productivity of individual wiring substrates. Ž<P>SOLUTION: The multi-piece wiring substrate 9 includes a plurality of wiring substrate regions 2 which are formed horizontally and vertically in an array on a mother substrate 1, and is divided by dicing processing at the boundary of the wiring substrate region 2. The multi-piece wiring substrate 9 includes a plurality of spaces 5 discontinuous in the direction of length of a boundary 2b which are formed at the boundary 2b of the wiring substrate region 2 of the mother substrate 1 so that the positions of the spaces adjacent to each other in the plan view are different tin the direction of thickness of the mother substrate 1 and formed so as to be continuous in the direction of length of the boundary 2b. The thickness of the mother substrate 1 to be cut actually by dicing machining is reduced by an amount corresponding to the space 5, and accordingly, it is possible to increase the cutting speed while suppressing the occurrence of chips and to obtain the multi-piece wiring substrate 9 excellent in productivity of individual wiring substrates. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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