| 摘要 |
The device has a covering element (7) i.e. flap, and a thermal positioning element (9) arranged within a housing (4), where volume flow rate of a cool air flowing via a cylinder orifice (5) of the housing is controllable via the covering element. The covering element covers the cylinder orifice in an adjustable manner, where adjusting of the covering of the orifice takes place via a thermal positioning element. The positioning element exhibits a temperature dependent deformation that is utilized for adjusting the covering, and is designed as an expansion material processing element. |
