| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure with a sealing resin layer for greatly reducing the heat-dissipation restriction of a component when mounted. <P>SOLUTION: The mounting structure 100a formed by bonding the electrodes 13 of a substantially planar electronic component 1 to the electrodes 21 provided on the mounting surface of a circuit board 2 includes a sealing body 5 formed between one main surface of the electronic component 1 and the circuit board 2 and/or on the other main surface of the electronic component 1. The sealing body 5 is composed of a plurality of layers (5A, 5B) having different adhesive strengths and thermal conductivities, wherein a layer 5A having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component 1 and the circuit board 2, and a layer 5B having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component 1 and the circuit board 2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
