EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION, CURED BODY THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING THE EPOXY RESIN COMPOSITION

摘要

Disclosed is an epoxy resin composition for optical semiconductor device encapsulation, which contains the following components (A)-(D). (A) an epoxy resin having two or more epoxy groups in a molecule (B) an acid anhydride curing agent (C) a curing accelerator (D) an alcohol compound having three or more primary hydroxy groups in a molecule The epoxy resin composition for optical semiconductor device encapsulation is excellent in heat resistance and light resistance, and enables to greatly suppress occurrence of cracks in the sealing resin.