| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power semiconductor device improving productivity and miniaturization, reducing a mounting area, and allowing an increase in current regardless of external terminals. <P>SOLUTION: In a power semiconductor device sealed with a transfer molding resin, a cylindrical external terminal communication section is installed roughly perpendicularly to a wiring pattern, and an external terminal can be inserted into the cylindrical external terminal communication section for connection. The inserted external terminal and the wiring pattern can be electrically connected, and at least the end part bonded with the wiring pattern is provided with a taper. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
