| 摘要 |
A method for bonding silicon-containing compositions to metal surfaces is disclosed wherein a coarse silicon-containing surface is arc-sprayed with a first adhesive layer (12), a second solderable layer (14), and a third solder (16) layer, and the arc-sprayed surface is then soldered to the metal surface. The method is particularly useful for producing silicon-containing targets for cathode sputtering. <IMAGE> |
