发明名称 MODULE MOUNTING STRUCTURE OF PCB
摘要 PURPOSE: A module mounting structure of a printed circuit board is provided to reduce the thickness of an electronic component and the printed circuit board by inserting the module substrate into an insertion hole of the main cover. CONSTITUTION: A module includes a module substrate(110) and a module cover(120). A junction groove(114) is formed on an edge part of the module substrate. The module substrate is inserted into an insertion hole(134) of the main substrate. A combination protrusion is formed on an inner circumference of the insertion hole. The combination protrusion is inserted into the junction groove. The junction surface is formed on the inner surface of the junction groove. The combination surface is formed on an outer surface of the combination protrusion. The combination surface is contacted with the junction surface for electrically connecting the circuit of the main substrate to the circuit of the module substrate.
申请公布号 KR20100011334(A) 申请公布日期 2010.02.03
申请号 KR20080072494 申请日期 2008.07.24
申请人 KOREA ELECTRIC TERMINAL CO., LTD. 发明人 YUN, BYEUNG YUN
分类号 H05K7/08 主分类号 H05K7/08
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