发明名称 |
CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
|
申请公布号 |
US2010015404(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20090504996 |
申请日期 |
2009.07.17 |
申请人 |
WORLD PROPERTIES, INC. |
发明人 |
PAUL SANKAR K.;CAISSE CHRISTOPHER J.;BAARS DIRK M.;HORN, III ALLEN F. |
分类号 |
B32B5/16;B32B3/10;B32B37/00 |
主分类号 |
B32B5/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|