发明名称 Application specific semiconductor integrated circuit and its manufacturing method thereof
摘要 An ASIC includes a first-wire extended in a first-direction and a second-wire extended in a parallel direction to the first-wire and both are placed on a first-wire layer; and a third-wire placed on a second-wire layer above the first-wire layer and is extended above the wire and above the second-wire in a second-direction which intersects the first-direction and passing through a first via-hole is connected to the first-wire, and a fourth-wire separated from the third-wire extended in a parallel direction above the first-wire and above the second-wire and a fifth-wire separated from both the third-wire and the fourth-wire and extended in a parallel direction in a smallest space and passing through a second via-hole is connected to the second-wire, wherein, one end of the fifth-wire is extended to the center between the second-wire and the first-wire from above the second-wire.
申请公布号 US7650584(B2) 申请公布日期 2010.01.19
申请号 US20070838605 申请日期 2007.08.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SHIGA HITOSHI;SAKURAI KIYOFUMI;MIMA KENJI
分类号 G06F17/50;G06F9/45 主分类号 G06F17/50
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