发明名称 METHOD AND APPARATUS FOR LASER MACHINING
摘要 Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. Endpointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.
申请公布号 WO2010006067(A2) 申请公布日期 2010.01.14
申请号 WO2009US49961 申请日期 2009.07.08
申请人 FEI COMPANY;STRAW, MARCUS;TOTH, MILOS;UTLAUT, MARK;NARUM, DAVID, H.;KNIPPELS, GUIDO;VEEN, GERARDUS NICOLAAS ANNE VAN 发明人 STRAW, MARCUS;TOTH, MILOS;UTLAUT, MARK;NARUM, DAVID, H.;KNIPPELS, GUIDO;VEEN, GERARDUS NICOLAAS ANNE VAN
分类号 B23K26/36;B23K26/12;B23K26/42;G01N23/225 主分类号 B23K26/36
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