| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling off tape capable of peeling off an adhesive sheet stuck to a body to be adhered while grasping a grasp part without adhesion. SOLUTION: The peeling off tape PT is used for peeling off the adhesive sheet S from a semiconductor wafer W by sticking it to a surface of the protection adhesive sheet S stuck onto the semiconductor wafer W. In the peeling off tape PT, the adhesive part 10 is formed by providing an adhesive layer A on a predetermined area of a base material sheet BS, and the grasp part 11 is formed by an area where the adhesive layer A is not provided on the base material sheet BS. When the adhesive sheet S is peeled off from the semiconductor wafer W, the adhesive part 10 is stuck onto the adhesive sheet S, and the grasp part 11 is grasped and pulled, thereby, the adhesive sheet S can be peeled off. COPYRIGHT: (C)2010,JPO&INPIT |
