Semiconductor device capsule

摘要

A semiconductor device capsule (30) comprising a semiconductor assembly (32) mounted between opposed poles (34,36). At least one of the poles (34,36) includes slots (38) around the location of the or each chip or group of chips (46) within the semiconductor assembly (32) to define a contact body portion (37) on which the or each chip or group of chips (46) is mounted and reduce the thickness of a laterally continuous body portion (39) of the pole (36).