发明名称 Lead pin for package boards
摘要 Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.
申请公布号 US2010000761(A1) 申请公布日期 2010.01.07
申请号 US20080232316 申请日期 2008.09.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH HUENG JAE;CHOI JIN WON
分类号 H01B5/00 主分类号 H01B5/00
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