| 摘要 |
<p>PURPOSE: A printed substrate and an electronic device are provided to prevent separation between a printed substrate and a solder bump by preventing concentration of a load about the solder bump. CONSTITUTION: A printed substrate(30) includes a plurality of pads and a hole(35). The pads are installed inside a mounting region. The mounting region has a polygonal shape. The hole is extended according to adjacent two sides of polygonal, and includes a first hole, a second hole, a third hole, and a fourth hole. The first hole is extended according to a first side and a second side of the polygon. The second hole is extended according to a third side and a fourth side of the polygon. The third hole is extended according to the first side and the fourth side. The fourth hole is extended according to the second side and the third side.</p> |
