发明名称 CONTROLS OF AMBIENT ENVIRONMENT DURING WAFER DRYING USING PROXIMITY HEAD
摘要 A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.
申请公布号 US2009320884(A1) 申请公布日期 2009.12.31
申请号 US20090555217 申请日期 2009.09.08
申请人 KOROLIK MIKHAIL;LARIOS JOHN M DE;RAVKIN MIKE;FARBER JEFFREY 发明人 KOROLIK MIKHAIL;LARIOS JOHN M. DE;RAVKIN MIKE;FARBER JEFFREY
分类号 B08B3/00;C25D5/22;C25D7/12;H01L21/00 主分类号 B08B3/00
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