| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that is stuck to a member, such as a semiconductor wafer, at low temperature and prevents bubbles from being generated easily between an adhesive film and a support member when sticking, for example, the adhesive film to the support member. <P>SOLUTION: In the method for manufacturing the semiconductor device, a first varnish containing a first adhesive resin composition and a second varnish containing a second adhesive resin composition different from the first one are overlapped onto a base material 2. Then, the first and second varnishes are dried to form an adhesive film 1 on the base material 2. A semiconductor wafer W is stuck to a high-tack surface A of the adhesive film 1. The semiconductor wafer W is cut. A semiconductor element 8 having an adhesive layer is picked up and adhered to a wiring board. In an adhesive layer 7, a recess formed between lines is embedded when heating at 170°C for two hours. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
