| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering system where the confinement of plasma at the surface of a target is improved, plasma near a substrate is reduced, and low temperature film deposition is possible with low damage. Ž<P>SOLUTION: In the sputtering system comprising: a vacuum tank capable of retaining a vacuum; a substrate holder arranged in the vacuum tank and mounted with a substrate; target holders arranged in a vertical direction to the substrate and also disposed with two targets so as to face each other; a sputtering power source applying direct current or alternating current to the target holders; and a gas exhausting means introducing or exhausting gas into/from the vacuum tank, target holders mounted with pairs of magnets in which the same facing polarities are provided at the rear of the two targets. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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