Cooling assembly with direct cooling of active electronic components,申请号EP20080004223-传众专利搜索

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发明名称	Cooling assembly with direct cooling of active electronic components
摘要
申请公布号	EP1940213(A3)	申请公布日期	2009.12.16
申请号	EP20080004223	申请日期	2002.12.23
申请人	FORMFACTOR, INC.	发明人	MILLER, CHARLES A.
分类号	G01R1/073;G01R31/28;G01R1/067;H01L21/66;H05K7/20	主分类号	G01R1/073
代理机构		代理人
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