| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-made package for semiconductor element mounting which has a high sealing property although being made of resin, and further has high flexibility in wiring by employing a stack of resin films. Ž<P>SOLUTION: The package for semiconductor element mounting has (1) a printed circuit board 1 which has a base having a mounting surface for mounting a semiconductor element and a conductor arranged on the base, the conductor including an inner lead 1-2 to be coupled to the semiconductor element mounted on the base and an outer lead to be coupled to external wiring; and (2) a resin-made frame 2 enclosing the mounting surface. The package for semiconductor element mounting further has a water-impermeable film disposed in a region enclosed with the resin-made frame 2 on a surface or inside of the base. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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