| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in substrate which has superior electric reliability. <P>SOLUTION: The component built-in substrate 2 includes a first film layer 5a which has a coefficient of plane-direction thermal expansion smaller than a coefficient of thickness-direction thermal expansion, a conductive layer 8 formed on the first film layer 5a, an insulating layer 6 formed on the conductive layer 8 and has a coefficient of plane-direction thermal expansion larger than a coefficient of plane-direction thermal expansion of the first film layer 5a, an electronic component 7 provided in the insulating layer 6 and connected to the conductive layer 8, and a second film layer 5b formed on the insulating layer 6 and having a coefficient of plane-direction thermal expansion smaller than a coefficient of thickness-direction thermal expansion. <P>COPYRIGHT: (C)2010,JPO&INPIT |
