| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, the resin having excellent adhesiveness with a lead frame and giving a semiconductor device with high reliability even when a nickel-plated lead frame is used, and to provide a semiconductor device using the composition. Ž<P>SOLUTION: The epoxy resin composition for sealing includes an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as essential components, wherein a trimellitic acid salt of an imidazole compound expressed by general formula (I) is used as the curing accelerator. In formula, R represents an alkyl group having 8 to 14 carbon atoms or a phenyl group. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
