| 摘要 |
Provided are a substrate processing apparatus and a substrate processing method wherein adhesiveness between a metal mask and a substrate is improved in a pattern region where the metal mask is relatively thin. In one embodiment of this invention, in a system for adhering and fixing a metal mask (006) to a process target surface of a substrate (005) by using a magnet (007), both thick regions and thin regions exist in the metal mask (006). The magnet (007) has at least one boundary between an N pole and the S pole on the side facing the substrate (005), and the boundary is formed to face only the thick region of the metal mask (006).
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