发明名称 |
Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference |
摘要 |
A plurality of stacked semiconductor wafers each contain a plurality of semiconductor die. The semiconductor die each have a conductive via formed through the die. A gap is created between the semiconductor die. A conductive material is deposited in a bottom portion of the gap. An insulating material is deposited in the gap and over the semiconductor die. A portion of the insulating material in the gap is removed to form a recess between each semiconductor die extending to the conductive material. A shielding layer is formed over the insulating material and in the recess to contact the conductive material. The shielding layer isolates the semiconductor die from inter-device interference. A substrate is formed as a build-up structure on the semiconductor die adjacent to the conductive material. The conductive material electrically connects to a ground point in the substrate. The gap is singulating to separate the semiconductor die.
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申请公布号 |
US2009302435(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20080133216 |
申请日期 |
2008.06.04 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
PAGAILA REZA A.;DO BYUNG TAI;KUAN HEAP HOE;HUANG RUI |
分类号 |
H01L23/552;H01L21/50 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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