ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME

摘要

To provide an electronic circuit board in which a conductive wire is excellently connected to a bonding pad formed directly on a polyimide film. The electronic circuit includes: a first layer metal pattern 3 formed on a substrate 1; a polyimide film 2 formed on the first layer metal pattern 3; and a second layer metal pattern formed on a surface of the polyimide film 2. A conductive bump 4 is formed on the surface of the second layer metal pattern 31 by ball-bonding to provide electrical connection with a semiconductor chip 7 bonded to the first layer metal pattern by die-bonding. The conductive bump 4 is electrically connected to an electrode 72 of the semiconductor chip 7 by wire bonding.