| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad which suppresses damage to a polishing layer during chemical mechanical polishing and has a long product life, and a chemical mechanical polishing method using the chemical mechanical polishing pad to offer high quality. <P>SOLUTION: The chemical mechanical polishing pad used for chemical mechanical polishing includes a polishing layer having: a polishing surface which comes into contact with an object to be polished to carry out chemical mechanical polishing; a non-polishing surface at the opposite side to the polishing surface; a first recess formed in an area on the polishing surface including a central portion; and a second recess formed at a position on the non-polishing surface, the position being opposite at least to part of the first recess. <P>COPYRIGHT: (C)2010,JPO&INPIT |
