发明名称 PACKAGE AND METHOD OF MENUFACTURING PACKAGE
摘要 PURPOSE: A package and method of manufacturing package are provided to reduce the stress generated in the core unit and the damage of the insulating layer. CONSTITUTION: One or more groove is formed in the core unit. And a plurality of main core(120) is formed with groove. The insulating layer(130) is formed in the surface of the core unit. The patterned portion is prepared in the surface of the insulating layer. The projecting core(122) is formed in the end part of the main core by cutting the groove. The part for package is bonded on the pattern unit. The electrode pattern(140) is formed in the entire surface of the insulating layer.
申请公布号 KR20090124234(A) 申请公布日期 2009.12.03
申请号 KR20080050310 申请日期 2008.05.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KO, KUN YOO;CHOI, SEUNG HWAN;KIM, IL KU;CHO, HYOK YOUNG;PARK, JUNG KYU
分类号 H01L23/48;H01L21/60 主分类号 H01L23/48
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