| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip chip mounting method capable of improving the reliability in electric connection by preventing that a semiconductor chip is damaged, and that the connection between the bump of a semiconductor chip and the pad of a mounting board becomes inadequate, at the time of the flip chip mounting of the semiconductor chip. <P>SOLUTION: The flip chip mounting method for mounting a semiconductor chip 10 in a substrate 15 by flip chip connection is provided with a positioning junction process for joining a bump 11 and a pad 16 by pressurizing a semiconductor chip at a substrate, after performing the alignment of the bump 11 provided in the semiconductor chip 10 and the pad 16 provided in the substrate 15; an active junction process for carrying out active junction of the bump 11 and the pad 16 after performing plasma etching to the semiconductor chip 10 and the substrate 15 joined by the positioning junction process in an argon gas atmosphere; and an underfill process for filling up the joined part of the semiconductor chip 10 and the substrate 15 with underfill resin 18 which is made to heat-harden after the activity junction. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
