发明名称 |
METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART |
摘要 |
When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03 - 0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength. |
申请公布号 |
EP1894667(A4) |
申请公布日期 |
2009.12.02 |
申请号 |
EP20050750722 |
申请日期 |
2005.06.10 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
KURATA, RYOICHI;SOUMA, DAISUKE;OKADA, HIROSHI |
分类号 |
B23K35/26;B23K1/19;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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