| 摘要 |
FIELD: technological processes. ^ SUBSTANCE: in process of manufacturing of multi-layer substrate (100) for identification card, diffraction first relief structure is formed with ratio of depth to width of separate structural elements of more than 0.3 in the first area (5) of multiplying layer (3) of multi-layer substrate. The first layer (3m) is applied onto multiplying layer in the first area and in the second area (4, 6), in which the first relief structure is not formed in multiplying layer, with constant surface density relative to plane specified with multiplying layer. The first layer (3m) is partially removed to the extent determined by the first relief structure so that the first layer is removed in the first area, but not in the second area, or in the second area, but not in the first area. ^ EFFECT: invention provides for high accuracy of layer positioning on substrate. ^ 42 cl, 21 dwg, 2 tbl |
