发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that decreases an exhaustion amount while securing necessary exhaustion. Ž<P>SOLUTION: A control unit 51 predetermines the timing when a lot is carried and treated by chemical treatment sections CHB1 and CHB2 and pure ware cleaning treatment sections ONB1 and ONB2, so dumpers 37 and 41, and 45 and 49 are operated according to states of the chemical treatment sections CHB1 and CHB2 and pure ware cleaning treatment sections ONB1 and ONB2 to adjust exhaustion flow rates of exhaustion from exhaust ports 35 and 39, and 43 and 47 of the chemical treatment sections CHB1 and CHB2 and pure water cleaning treatment sections ONB1 and ONB2. Consequently, the exhaustion amount of the whole apparatus is reducible while exhaustion necessary for treatments is secured. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009277789(A) 申请公布日期 2009.11.26
申请号 JP20080126126 申请日期 2008.05.13
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KURASAKI KOJI;AKAO KIYOSHI;YASUI KENJI;NAKANO HARUMASA
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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