发明名称 |
CURABLE SILICONE COMPOSITION AND ELECTRONIC COMPONENT |
摘要 |
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion. |
申请公布号 |
KR20090099060(A) |
申请公布日期 |
2009.09.21 |
申请号 |
KR20097013185 |
申请日期 |
2007.12.14 |
申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
MORITA YOSHITSUGU;KATO TOMOKO |
分类号 |
C08L83/04;C08K5/151;C08K5/541;H01L23/29 |
主分类号 |
C08L83/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|