LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING SAME

摘要

PROBLEM TO BE SOLVED: To provide a light emitting device package having improved heat dissipation performance and a method of manufacturing the same.

SOLUTION: The light emitting device package including: a metal core 10; an insulating layer 20 formed on the metal core 10; a metal layer 30 formed on the insulating layer 20; a first cavity 40 formed by removing parts of the metal layer 30 and the insulating layer 20 to expose a top surface of the metal core 10; and a light emitting device 60 directly mounted on the top surface of the metal core 10 in the first cavity 40, is provided.

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