| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinder that senses, on the grinder, the thickness of a wafer immediately after it is ground. SOLUTION: The grinder is equipped with a chuck table having a holding surface for a plate form object, a grinding means to grind the plate held by the chuck table, and a plate transporting means fitted with a transporting pad to suck fast the work ground on the chuck table and having a suction surface with a smaller diameter than the work, characterized by that the arrangement further includes a first non-contact distance measuring means installed over the pad on the transport path for the pad holding the work and measuring the distance to the plate oversurface, a second non-contact distance measuring means installed under the pad on the transport path for the pad in such a manner as confronting the first measuring means and measuring the distance to the plate undersurface, and a memory means to store the distance to the plate oversurface obtained by the first measuring means and the distance to the plate undersurface obtained by the second measuring means. COPYRIGHT: (C)2010,JPO&INPIT
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