| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the occurrence of cracks under electrode pads while having a structure that bumps on a circuit board are connected to the electrode pads formed on a semiconductor chip, and to provide a method for manufacturing the semiconductor device. SOLUTION: The method for manufacturing the semiconductor device includes: a step of forming bumps 3 on wiring electrodes 5 of a circuit board 4; a step of forming resin projections 9 on bump-corresponding positions of electrode pads 2 of a semiconductor chip 1; a step of disposing a thermosetting insulating resin sheet 6' on the electrode-forming surface of either one of the semiconductor chip 1 and the circuit board 4; a step of positioning the semiconductor chip 1 and the circuit board 4 so that the electrode pads 2 and the wiring electrodes 5 are opposed to each other; and a step of heat-curing the insulating resin sheet 6' to form an insulating resin 6 while pressurizing the semiconductor chip 1 to the circuit board 4 and leveling the bumps 3 by bringing the bumps into contact with the resin projections 9 and the electrode pads 2. COPYRIGHT: (C)2010,JPO&INPIT |
