发明名称 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
摘要 |
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages. |
申请公布号 |
US7615409(B2) |
申请公布日期 |
2009.11.10 |
申请号 |
US20060427695 |
申请日期 |
2006.06.29 |
申请人 |
SANDISK CORPORATION |
发明人 |
YU CHEEMEN;LIAO CHIH-CHIN;TAKIAR HEM |
分类号 |
H01L21/44;H01L21/30 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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