| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment method and a device therefor which can freeze liquid films on a substrate in a short time. SOLUTION: Since DIW (deionized water) fed to the surface Wf and back surface Wb of a substrate W for forming liquid films 11f, 11b on the surface wf and the back surface Wb of the substrate W is cooled to a temperature lower than ordinary temperature by a heat exchanger 623A, the time required for forming frozen films 13f, 13b can be reduced. Further, before the formation of the liquid films, by performing slow leak treatment, cooled DIW is made to flow out from piping 621A at a fine flow rate smaller than the flow rate upon liquid film formation, and the cooled DIW is circulated inside the piping 621A. In this way, the rise of the temperature of the cooled DIW within the piping 621A can be prevented, and, when the discharge of the DIW is started from nozzles 27, 97 for liquid film formation, the liquid films of the cooled DIW can be formed in a short time. COPYRIGHT: (C)2010,JPO&INPIT
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