发明名称 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 A conventional power MOSFET structure is difficult to improve a breakdown voltage of an element even using a super-junction structure. A power MOSFET according to an embodiment of the invention is a semiconductor device of a super-junction structure, including: a gate electrode filled in a trench formed on a semiconductor substrate; a gate wiring metal forming a surface layer; and a gate electrode plug connecting between the gate electrode and the gate wiring metal. Thus, a polysilicon layer necessary for the conventional typical power MOSFET is unnecessary. That is, column regions of an element active portion and an outer peripheral portion can be formed under the same conditions. As a result, it is possible to improve an element breakdown voltage as compared with the conventional one.
申请公布号 US2009275180(A1) 申请公布日期 2009.11.05
申请号 US20090503297 申请日期 2009.07.15
申请人 NEC ELECTRONICS CORPORATION 发明人 NINOMIYA HITOSHI;MIURA YOSHINAO
分类号 H01L21/8234;H01L21/77 主分类号 H01L21/8234
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