| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component including an interconnect structure. <P>SOLUTION: An electronic component (10) includes a base insulating layer (12) having a first surface (14) and a second surface (16); at least one electronic device (18) having a first surface (20) and a second surface (22), wherein the electronic device (18) is secured to the base insulating layer (12); at least one I/O contact (24) located on the first surface of the electronic device; and a frame panel (26) defining an aperture (42). The electronic device is disposed within the aperture, and the frame panel (26) is a multi-functional structure having a first region (28) composed of a first material; and a second region (30) composed of a second material, wherein the surface of the first region is secured to the base insulating layer, and the first material and the second material differ from each other and have different adhesivity to the base insulating layer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
