| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily determine ideal exposure conditions in a lithography. <P>SOLUTION: An exposure condition determination method for determining exposure conditions in the lithography for exposing a pattern to a photosensitive substrate via a projecting means includes a pattern generation step of generating a pattern, an exposure step of exposing a pattern to the photosensitive substrate for a plurality of times by changing the exposure conditions, an imaging step of generating an observation image by capturing an image of the photosensitive substrate where a pattern is exposed for a plurality of times in the exposure process, an image analysis step of analyzing the observation image generated in the imaging process, and a determination step of determining optimum exposure conditions, based on the results of the image analysis in the image analysis process. <P>COPYRIGHT: (C)2010,JPO&INPIT |
